One of the reason
of ST successes is the access to a large variety of processes
optimized for specific applications to be integrated on top of
pure CMOS technology whenever a System-on-Chip approach is required
-- like MEMS and Lab-on-Chip technologies. Another factor of success
is to bring together the wide range of resources, system know-how
and skills required to combine on a single chip complex and varied
functionalities previously independentely developed.
Technology strengths and proven custom chip design capabilities
are ST's key factors of success. With ST's world-class ASIC capabilities,
the customer is being given the ability to personalize DSP-based
super-integrated solutions for their specific applications.
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| Research efforts in advanced CMOS wafer probing and assembly,
thanks to the Crolles2 Alliance expertise, will provide winning
wafer testing and packaging techniques for devices produced on 300mm
wafers in 90nm, 65nm CMOS and beyond. Enabling future generations
of semiconductor technologies to support applications in the automotive,
consumer, industrial, networking and wireless markets. |
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Related Information
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Related Information |
About the Crolles2 Alliance
Crolles2 Alliance brings together STMicroelectronics,
Philips and Freescale Semiconductor, Inc., in an alliance of
unprecedented scope in the microelectronics sector. Their joint
Crolles2 center will focus on specific technologies at the forefront
of semiconductor R&D: baseline CMOS processing, embedded
memories, Silicon-On-Insulator, analog CMOS, advanced process
modules, advanced copper interconnect, low-power designs and
RF capabilities. Starting at 90-nm, the alliance will continue
on and develop CMOS processes at 65-nm, 45-nm and, ultimately,
the 32-nm node.
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